News
01.12.06
40th meeting BONDING
on 6th Dec. 2006, Hannover
On the 40th meeting of the work group A2.4 Bonding, SLCR Lasertechnik presented the possibilities for the removal of organic layers from electronic components.
Particularly the removal of parylene, a special loadable coating to protect against aggressive environmental influences, represents a special demand within the electronic range.







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