Decoating of bond pads

Electronic components are exposed to increasingly aggressive atmospheres. Examples are can be found in the aviation and space industry, the automobile industry, as well as in other industrial applications.

A possibility to protect electronics against aggressive environmental influences is for example the coating with a so-called parylene.

Fully equipped boards are provided in a vacuum method with a completely even and resistant protective layer.

However, this layer then also covers the contacts,  the so-called bond pads.

The process

With just a few pulses, a small area on the bond pads will be decoated. A metallic clean surface remains, which can then be immediately used for the bonding.

Due to the wavelength of the laser there are no changes to the metallic surface  - an absolutely necessary prerequisite.

The use of this new coating in combination with the SLCR process, assures the production advantages of the new coating without complex covering tasks. An absolute reproducible, reliable and precise decoating on bond pads will be achieved with reduced costs! 

The advantages of the process:

The SLCR decoating process will uncover the contact points fully automated for the following bond process.

• no complex masking with tape of the bond pads before coating
• no removal of tapes after the coating
• exact working on smallest contact points without impairment of the component environment
• treatment on final equipped components
• constant precise decoating to minimum costs